Comparison Overview

KLA

VS

TSMC

KLA

3 Technology Dr, Milpitas, 95035, US
Last Update: 2026-04-02
Between 800 and 849

KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging and printed circuit boards. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Visit us at: www.kla.com Statements made on LinkedIn may constitute forward-looking statements under federal securities laws. These forward-looking statements involve risks and uncertainties that could significantly affect the expected results and are based on certain key assumptions. Due to such uncertainties and risks, no assurances can be given that such expectations will prove to have been correct, and readers are cautioned not to place undue reliance on such forward-looking statements, which speak only as of the date indicated. Other risks that KLA faces include those detailed in KLA filings with the Securities and Exchange Commission, including KLA's annual report on Form 10-K and quarterly reports on Form 10-Q. Forward-looking statements made by third parties do not necessarily reflect the opinion of KLA, are outside of KLA’s control and have not been verified or otherwise vetted by KLA.

NAICS: 3344
NAICS Definition: Semiconductor and Other Electronic Component Manufacturing
Employees: 16,217
Subsidiaries: 1
12-month incidents
0
Known data breaches
0
Attack type number
0

TSMC

8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsinchu, 300, TW
Last Update: 2026-04-02
Between 800 and 849

Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore"​ wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality. The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest. TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM"​.

NAICS: 3344
NAICS Definition: Semiconductor and Other Electronic Component Manufacturing
Employees: 24,423
Subsidiaries: 2
12-month incidents
0
Known data breaches
3
Attack type number
2

Compliance Badges Comparison

Security & Compliance Standards Overview

https://images.rankiteo.com/companyimages/klacorp.jpeg
KLA
ISO 27001
ISO 27001 certification not verified
Not verified
SOC2 Type 1
SOC2 Type 1 certification not verified
Not verified
SOC2 Type 2
SOC2 Type 2 certification not verified
Not verified
GDPR
GDPR certification not verified
Not verified
PCI DSS
PCI DSS certification not verified
Not verified
HIPAA
HIPAA certification not verified
Not verified
https://images.rankiteo.com/companyimages/tsmc.jpeg
TSMC
ISO 27001
ISO 27001 certification not verified
Not verified
SOC2 Type 1
SOC2 Type 1 certification not verified
Not verified
SOC2 Type 2
SOC2 Type 2 certification not verified
Not verified
GDPR
GDPR certification not verified
Not verified
PCI DSS
PCI DSS certification not verified
Not verified
HIPAA
HIPAA certification not verified
Not verified
Compliance Summary
KLA
100%
Compliance Rate
0/4 Standards Verified
TSMC
0%
Compliance Rate
0/4 Standards Verified

Benchmark & Cyber Underwriting Signals

Incidents vs Semiconductor Manufacturing Industry Average (This Year)

No incidents recorded for KLA in 2026.

Incidents vs Semiconductor Manufacturing Industry Average (This Year)

No incidents recorded for TSMC in 2026.

Incident History — KLA (X = Date, Y = Severity)

KLA cyber incidents detection timeline including parent company and subsidiaries

Incident History — TSMC (X = Date, Y = Severity)

TSMC cyber incidents detection timeline including parent company and subsidiaries

Notable Incidents

Last 3 Security & Risk Events by Company

https://images.rankiteo.com/companyimages/klacorp.jpeg
KLA
Incidents

No Incident

https://images.rankiteo.com/companyimages/tsmc.jpeg
TSMC
Incidents

Date Detected: 8/2025
Type:Breach
Attack Vector: Insider Access
Motivation: Financial Gain, Corporate Espionage
Blog: Blog

Date Detected: 1/2025
Type:Breach
Attack Vector: Insider Threat
Motivation: Technology Theft, Industrial Espionage
Blog: Blog

Date Detected: 07/2023
Type:Breach
Motivation: Financial gain
Blog: Blog

FAQ

KLA company demonstrates a stronger AI Cybersecurity Score compared to TSMC company, reflecting its advanced cybersecurity posture governance and monitoring frameworks.

TSMC company has historically faced a number of disclosed cyber incidents, whereas KLA company has not reported any.

In the current year, TSMC company and KLA company have not reported any cyber incidents.

Neither TSMC company nor KLA company has reported experiencing a ransomware attack publicly.

TSMC company has disclosed at least one data breach, while KLA company has not reported such incidents publicly.

Neither TSMC company nor KLA company has reported experiencing targeted cyberattacks publicly.

Neither KLA company nor TSMC company has reported experiencing or disclosing vulnerabilities publicly.

Neither KLA nor TSMC holds any compliance certifications.

Neither company holds any compliance certifications.

TSMC company has more subsidiaries worldwide compared to KLA company.

TSMC company employs more people globally than KLA company, reflecting its scale as a Semiconductor Manufacturing.

Neither KLA nor TSMC holds SOC 2 Type 1 certification.

Neither KLA nor TSMC holds SOC 2 Type 2 certification.

Neither KLA nor TSMC holds ISO 27001 certification.

Neither KLA nor TSMC holds PCI DSS certification.

Neither KLA nor TSMC holds HIPAA certification.

Neither KLA nor TSMC holds GDPR certification.

Latest Global CVEs (Not Company-Specific)

Description

A vulnerability was found in Nothings stb up to 1.26. Impacted is the function stbtt_InitFont_internal in the library stb_truetype.h of the component TTF File Handler. Performing a manipulation results in out-of-bounds read. Remote exploitation of the attack is possible. The exploit has been made public and could be used. The vendor was contacted early about this disclosure but did not respond in any way.

Risk Information
cvss2
Base: 5.0
Severity: LOW
AV:N/AC:L/Au:N/C:N/I:N/A:P
cvss3
Base: 4.3
Severity: LOW
CVSS:3.1/AV:N/AC:L/PR:N/UI:R/S:U/C:N/I:N/A:L
cvss4
Base: 5.3
Severity: LOW
CVSS:4.0/AV:N/AC:L/AT:N/PR:N/UI:P/VC:N/VI:N/VA:L/SC:N/SI:N/SA:N/E:P/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
Description

V-SFT versions 6.2.10.0 and prior contain an out-of-bounds read in VS6ComFile!get_macro_mem_COM. Opening a crafted V7 file may lead to information disclosure from the affected product.

Risk Information
cvss3
Base: 7.8
Severity: LOW
CVSS:3.1/AV:L/AC:L/PR:N/UI:R/S:U/C:H/I:H/A:H
cvss4
Base: 8.4
Severity: LOW
CVSS:4.0/AV:L/AC:L/AT:N/PR:N/UI:A/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
Description

V-SFT versions 6.2.10.0 and prior contain a stack-based buffer overflow in VS6ComFile!CSaveData::_conv_AnimationItem. Opening a crafted V7 file may lead to arbitrary code execution on the affected product.

Risk Information
cvss3
Base: 7.8
Severity: LOW
CVSS:3.1/AV:L/AC:L/PR:N/UI:R/S:U/C:H/I:H/A:H
cvss4
Base: 8.4
Severity: LOW
CVSS:4.0/AV:L/AC:L/AT:N/PR:N/UI:A/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
Description

V-SFT versions 6.2.10.0 and prior contain an out-of-bounds read vulnerability in VS6MemInIF!set_temp_type_default. Opening a crafted V7 file may lead to information disclosure from the affected product.

Risk Information
cvss3
Base: 7.8
Severity: LOW
CVSS:3.1/AV:L/AC:L/PR:N/UI:R/S:U/C:H/I:H/A:H
cvss4
Base: 8.4
Severity: LOW
CVSS:4.0/AV:L/AC:L/AT:N/PR:N/UI:A/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X
Description

V-SFT versions 6.2.10.0 and prior contain an out-of-bounds read vulnerability in VS6ComFile!load_link_inf. Opening a crafted V7 file may lead to information disclosure from the affected product.

Risk Information
cvss3
Base: 7.8
Severity: LOW
CVSS:3.1/AV:L/AC:L/PR:N/UI:R/S:U/C:H/I:H/A:H
cvss4
Base: 8.4
Severity: LOW
CVSS:4.0/AV:L/AC:L/AT:N/PR:N/UI:A/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:X/CR:X/IR:X/AR:X/MAV:X/MAC:X/MAT:X/MPR:X/MUI:X/MVC:X/MVI:X/MVA:X/MSC:X/MSI:X/MSA:X/S:X/AU:X/R:X/V:X/RE:X/U:X